Photoveel - Machinable Mica Ceramics
These fine-grained machinable ceramics are not only machinable with conventional tooling, but also nearly as strong as alumina and other hard ceramics. Machinability plus high strength fine grain structure makes these materials an ideal fit for applications that require precision machined features.
Applications
- Semiconductor Equipment parts
- Semiconductor Inspection Parts
- Leaser Equipment Parts
- Vacuum Equipment Parts
- Thin film Deposition equipment Parts
- Liner Motor Parts
- Various Heat-insulating parts
- FPD Process Equipment Parts
- Adhesion Equipment Parts
- Positioning Parts
- Various sensor parts
- Analysis equipment parts
- Ultrasonic Generator
- Various Insulating parts...etc
Photoveel L
Characteristics of Photoveel L
Highly machinable mica ceramic with a proprietary formulation that gives it a finer grain structure.
Applications
- Insulation parts for various analyzer
- Large hole pitch probe cards
- Jig for soldering
- Light-condensing parts...etc
Photoveel L Products Photo
Properties of Photoveel
| Photoveel | Photoveel L | |||
| General Properties | Characteristics | Precision machinability | Low thermal expansion | |
| Main Component Purity (wt%) | - | - | ||
| Color | White | White | ||
| Density (g/cm3) | 2.59 | 3.06 | ||
| Water Absorption (%) | 0 | 0 | ||
| Mechanical Properties | Bending Strength (MPa) | 150 | 89 | |
| Young's Modulus (GPa) | 66 | - | ||
| Vickers Hardness (GPa) | 2.2 | 1.2 | ||
| Thermal Properties | Max.Operating Temperature (°C) | 1000 | 600 | |
| Coefficient of Thermal Expansion (1/°C×10-6) | RT~400°C | 8.5 | 6.1 | |
| Coefficient of Thermal Conductivity (W/m×K) | 1.7 | 1.8 | ||
| Thermal Shock Resistance ΔT (°C) | 150 | 200 | ||
| Electrical Properties | Volume Resistivity | 25°C | 1.8×1015 | 4.2×1015 |
| 300°C | - | - | ||
| 500°C | - | - | ||
| 800°C | - | - | ||
| Dielectric Constant | 10GHz | 6.1 | - | |
| Dielectric Loss (×10-4) | - | - | ||
| Q Factor (×104) | - | - | ||
| Dielectric Breakdown Voltage (KV/mm) | 18 | - | ||